LTCV10.7MA5UAC0F-R1

Place of Origin:	wuxi
Brand Name:	HM
Certification:	Rohs，ISO
Model Number:	ceramic filter 10.7Mhz LTCV10.7MA5UAC0F-R1

Minimum Order Quantity:	1000
Price:	$0.5
Packaging Details:	REEL
Delivery Time:	35 day
Payment Terms:	paypal, Western Union, MoneyGram
Supply Ability:	1000000pcs PER YEAR

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Detailed Product Description

Center Frequency:	10.7Mhz	Bandwidth(3dB):	280±50kHz Min
(6dB) Bandwidth(6dB):	290±50khz Min	Bandwidth(20dB):	±590.0KHz Max
(fo±100KHz) Stop Band Attenuation:	25dB Min	Ripple (within 3dB Bandwidth):	1.0dB Max
Insertion Loss （At Minimum Loss Point:	3.0dB Max	Temperature Stability （－20℃～ +80℃ ）:	±0.5% Max (-25℃ ～ +80℃)
(9MHz-12MHz)Spurious Response:	35 DB Min	（fo±2.0 KHz）GDT Ripple Deviation:	50μsec Max
Operating Temperature:	-20℃ ～ +80℃	Storage Temperature:	-40℃ ～ +85℃
Insulation Resistance(DC 25V 1 Minute):	100MΩ Min	Input/Output Impedance:	330 Ω

ELECTRICAL SPECIFICATIONS

1 RATING

Items	Content
Withstanding Voltage (V)	50 (DC,1min)
Insulation Resistance Ri,(MΩ)min.	100 (10V,1min)
Operating Temperature Range (℃)	-20～+80
Storage Temperature Range (℃)	-40～+85

2 ELECTRICAL SPECIFICATIONS

NO.	Item	Measurement condition	Requirement
７－１	Random Drop	Filter shall be measured after 3 times random drops from the height of 30cm on concrete floor	No visible damage and it meet Table 1
７－２


	Vibration	Filter shall be measured after being applied	No damage and it meet
		vibration of amplitude of 1.5mm with 10-55Hz	Table 1.
		band of vibration frequency to each of 3
		perpendicular directions for 2 hours
７－3	Solderability
		Lead terminals are immersed in aide solder for 5 sec and then immersed in soldering bath of	At least 95% lead terminals shall be covered
		230±5℃, for 3±0.5 sec.	with solder.
７－4	Substrate Bending Test		It shall meet table 1.

		Apply pressure in the direction of arrow (see Fig. 3) at a rate of about 0.5mm per second until it
		reaches a
		bend of 3mm and hold for 30 seconds.
７－5




	Adhesion	A static load of 20N to the direction of the	It shall meet Table 1.
		arrow (see
		Fig. 4) shall be applied on the core of the
		component
		and hold for 10 seconds. Filter shall be

		soldered correctly and tightly to PCB.
7－6	Reflow Soldering		It shall meet Table 1.



		Put on the solder paste on the printed wiring board (pattern is shown in Fig. 5), the samples
		shall be mounted and soldered under the
		condition (pattern is shown in Fig. 6), then it
		shall be subjected to the room atmosphere for
		24 hours prior to the measurement.

NO.	Item	Measurement condition	Requirement
8 – 1	Humidity		It shall meet Table 1.

		After being placed in a chamber with 90-95% R.H. at 40±2℃ for 100 hours and then being
		placed in room temperature for 1 hour, filter
		shall be measured.
8 – 2



	Resistance to	Lead terminals are immersed up to 1.5mm
	Solder Heat	from filter’s body in soldering bath of 350±	It shall meet Table 1.
		10℃, for 3±0.5 sec. And then filter shall be
		measured after being placed in room
		temperature for 1 hour.
8 – 3	High Temperature		It shall meet Table1
		After being placed in a chamber with 80±2 ℃,for 100 hours and then being placed in room temperature for 1 hour , filter shall be
		measured.
8 – 4	Low Temperature	After being placed in a chamber with -20±2 ℃,for 100 hours and then being placed in	It shall meet Table 1

		room temperature for 1 hour, filter shall be measured.
8 – 5	Heat Shock		It shall meet Table 1




		After being kept at room temperature, filter shall be placed at temperature of –55 ℃ , for
		30 minutes, then be placed at temperature. 85
		℃, for 30 minutes. After that returned to –55
		℃ again. Repeated above cycle for 5 times.
		After being kept in room temp. for 1 hour,
		filter shall be measured